Teaching Assistant Dr ONG Yue Ying

B.Sc. (Hons), PhD, National University of Singapore


Contact Information


Department of Chemistry, NUS 
3 Science Drive 3 
Singapore 117543 
Office: S5-04-08
Tel: 6516-2665
Email: chmoyy@nus.edu.sg


Representative Publications

  • Nur Yaisyah Bte Md Yasin, Ong Yueying, Evaluating the Relevance of the Chemistry Curriculum to the Workplace: Keeping Tertiary Education Relevant, J. Chem. Educ., 2017, 94 (10), 1443–1449
  • Yue Ying Ong, Soon Wee Ho, Vasarla Nagendra Sekhar, et al., Underfill Selection, Characterization and Reliability Study for Fine-Pitch, Large Die Cu/low-K Flip Chip Package. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011, 1 (3), 279 – 290
  • Tai Chong Chai, Xiaowu Zhang, J H Lau, C S Selvanayagam, P Damaruganath, Y Y G Hoe, Yue Ying Ong, et al. Development of Large Die Fine-Pitch Cu/Low-k FCBGA Package With Through Silicon via (TSV) Interposer. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011, 1 (5), 660-672
  • Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, et al. Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. Microelectronics Reliability, 2010, 50 (7), 986-994
  • X. Ong, S. W. Ho, Y. Y. Ong, et al. Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. Microelectronics Reliability, 2009, 49 (2), 150-162
  • X. Zhang, A. Kumar, Q. X. Zhang, Y. Y. Ong, et al. Application of Piezoresistive Stress Sensors in Ultra Thin Device Handling and Characterization. Sensors and Actuators A: Physical, 2009, 156 (1), 2-7
  • Kian Eang Neo, Yue Ying Ong, Han Vinh Huynh, T.S. Andy Hor. A single-molecular pathway from heterometallic MM′ (M = BaII, MnII; M′ = CrIII) oxalato complexes to intermetallic composite oxides. J. Mater. Chem., 2007, 17, 1002 – 1006
  • Patent: Y. L. Lim, Y. Y. Ong, L. L. Yan, V. Kripesh, S. R. Method for micro component self-assembly, 2007, US 20090116207