Teaching Assistant ONG Yue Ying




B.Sc. (Hons), PhD, National University of Singapore

Contact Information

Office: S5-04-08
Tel: (65)-6516-2665 | Fax: (65)-6779-1691
Email: chmoyy@nus.edu.sg


 

Research Interests

  • Examining Current Chemistry Program and Exploring Areas of Improvement
  • Studying to Minimise Chemical Waste Generated in Teaching Laboratories
  • Enhancing Student Learning through Better Feedback System
  • Research interests in applications of organic chemistry and materials, spectroscopic study of coordination complexes, analytical methods, etc

 

Teaching Contributions

  • CM1401 Chemistry for Life Sciences
  • CM1501 Organic Chemistry for Engineers
  • CM2191 Experiments in Chemistry 2
  • CM5201 Practical Synthetic and Analytical Chemistry

 

Representative Publications

  • M. Y., Nur Yaisyah, and Ong, Y. Y. 2017. “Evaluating the Relevance of the Chemistry Curriculum to the Workplace: Keeping Tertiary Education Relevant.” Journal of Chemical Education 94 (10): 1443 – 1449.
  • Ong, Y. Y., Ho, S. W., Vasarla, N. S., Ong, X. F., Ong, Jimmy, Zhang, X. W., Vaidyanathan, K., and et al. 2011. “Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.” IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (3): 279 – 290.
  • Ong, Y. Y., Ho, S. W., Vaidyanathan, K., Vasarla, N. S., Jong, M. C., Lim, Y. L., Lee, W. S., and et al. 2010. “Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.” Microelectronics Reliability 50 (7): 986 – 994.
  • Ong, Y. Y., Chai, T. C., Yu, D. Q., Thew, M. L., Myo, E., Wai, L. C., Jong, M. C., and et al. 2009. “Assembly and Reliability of Microbumped chips with Through-silicon Vias (TSV) interposer.” Paper presented at 11th Electronics Packaging Technology Conference, Singapore, December 9 – 11.
  • Ong, Y. Y., Vaidyanathan, K., Ho, S. W., Vasarla, N. S., Jong, M. C., Wai, L. C., Vempati, S., and et al. 2008 “Design, Assembly and Reliability of Large Die (21x21mm2) and Fine-pitch (150μm) Cu/low-k Flip Chip Package.” Paper presented at 10th Electronic Packaging Technology Conference, Singapore, December 9 – 12.
  • Ong, Y. Y., Lim, Y. L., Yan, L. L., Vempati, S., Liao, E. B., Vaidyanathan, K., Yoon, S. U., and et al. 2007. “Self-Assembly of components Using Shape-Matching.” Paper presented at 9th Electronic Packaging Technology Conference, Singapore, December 10 – 12.
  • Neo, K. E., Ong, Y.Y., Huynh, H.V., Hor, T.S.A. 2007. “A single-molecular pathway from heterometallic MM′ (M = BaII, MnII; M′ = CrIII) oxalato complexes to intermetallic composite oxides.” Journal of Materials Chemistry 10 (17): 1002 – 1006.
  • Lim, Y.L., Ong, Y.Y., Yan, L.L., Kripesh, Vempati. S. R., and Liao, E. B., 2007. Method for micro component self-assembly. US Patent 20090116207, filed November 5.
  • Ong, Y.Y.; Lim, Y.L.; Yan, L.L.; Liao, E.B.; Kripesh, V. 2006. “Dry Self-Assembly & Gangbonding of Microcomponents from Silicon Carrier to Substrate Wafer.” Paper presented at 31st International Electronics Manufacturing Technology Symposium, Malaysia, November 8 – 10.
  • Ong, Y. Y.; Yan, L.L.; Kripesh, V. 2006. Removal of Self-Assembled Monolayer on Gold Substrates. Poster presented at Asia-Pacific Conference of Transducers and Micro-Nano Technology, Singapore, June 25 – 28.