Examining Current Chemistry Program and Exploring Areas of Improvement
Studying to Minimise Chemical Waste Generated in Teaching Laboratories
Enhancing Student Learning through Better Feedback System
Research interests in applications of organic chemistry and materials, spectroscopic study of coordination complexes, analytical methods, etc
CM1401 Chemistry for Life Sciences
CM1501 Organic Chemistry for Engineers
CM2191 Experiments in Chemistry 2
CM5201 Practical Synthetic and Analytical Chemistry
Md Yasin, N.Y.; Ong, Y.Y. Evaluating the Relevance of the Chemistry Curriculum to the Workplace: Keeping Tertiary Education Relevant. J. Chem. Educ.2017, 94, 1443–1449.
Ong, Y.Y.; Ho, S.W.; Sekhar, V.N. et al. Underfill Selection, Characterization and Reliability Study for Fine-Pitch, Large Die Cu/low-K Flip Chip Package. IEEE Trans. Compon. Packaging Manuf. Technol.2011, 1, 279 – 290.
Ong, Y.Y.; Ho, S. W.; Vaidyanathan, K. et al. Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. Microelectron. Reliab.2010, 50, 986-994.
Ong, Y.Y.; Chai, T. C.; Yu, D. et al. Assembly and Reliability of Microbumped chips with Through-silicon Vias (TSV) interposer. In Proceedings of the 11th Electronics Packaging Technology Conference, 2009; pp 452-458.
Ong, Y.Y.; Kripesh, V.; Ho, S.W. et al. Design, Assembly and Reliability of Large Die (21x21mm2) and Fine-pitch (150μm) Cu/low-k Flip Chip Package. In Proceedings of the 10th Electronic Packaging Technology Conference, 2008; pp 613-619.
Ong, Y.Y.; Lim, Y. L.; Yan, L.L.; Vempati, S.; Liao, E.B.; Kripesh, V.; Yoon, S.U. Self-Assembly of components Using Shape-Matching. In the Proceedings of the 9th Electronic Packaging Technology Conference, 2007; pp 826-829.
Neo, K. E.; Ong, Y.Y.; Huynh, H.V.; Hor, T.S.A. A single-molecular pathway from heterometallic MM′ (M = BaII, MnII; M′ = CrIII) oxalato complexes to intermetallic composite oxides. J. Mater. Chem., 2007, 17, 1002 – 1006.
Lim, Y.L.; Ong, Y.Y.; Yan, L.L.; Kripesh, V. S. R. Method for micro component self-assembly, 2007, US Patent 20090116207.
Ong, Y.Y.; Lim, Y.L.; Yan, L.L.; Liao, E.B.; Kripesh, V. Dry Self-Assembly & Gangbonding of Microcomponents from Silicon Carrier to Substrate Wafer. In the Proceedings of IEMT, 2006, pp 486-491.
Ong, Y. Y.; Yan, L.L.; Kripesh, V. Removal of Self-Assembled Monolayer on Gold Substrates. In the Proceedings of APCOT, 2006.