Examining Current Chemistry Program and Exploring Areas of Improvement
Studying to Minimise Chemical Waste Generated in Teaching Laboratories
Enhancing Student Learning through Better Feedback System
Research interests in applications of organic chemistry and materials, spectroscopic study of coordination complexes, analytical methods, etc
CM1401 Chemistry for Life Sciences
CM1501 Organic Chemistry for Engineers
CM2191 Experiments in Chemistry 2
CM5201 Practical Synthetic and Analytical Chemistry
M. Y., Nur Yaisyah, and Ong, Y. Y. 2017. “Evaluating the Relevance of the Chemistry Curriculum to the Workplace: Keeping Tertiary Education Relevant.” Journal of Chemical Education 94 (10): 1443 – 1449.
Ong, Y. Y., Ho, S. W., Vasarla, N. S., Ong, X. F., Ong, Jimmy, Zhang, X. W., Vaidyanathan, K., and et al. 2011. “Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.” IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (3): 279 – 290.
Ong, Y. Y., Ho, S. W., Vaidyanathan, K., Vasarla, N. S., Jong, M. C., Lim, Y. L., Lee, W. S., and et al. 2010. “Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.” Microelectronics Reliability 50 (7): 986 – 994.
Ong, Y. Y., Chai, T. C., Yu, D. Q., Thew, M. L., Myo, E., Wai, L. C., Jong, M. C., and et al. 2009. “Assembly and Reliability of Microbumped chips with Through-silicon Vias (TSV) interposer.” Paper presented at 11th Electronics Packaging Technology Conference, Singapore, December 9 – 11.
Ong, Y. Y., Vaidyanathan, K., Ho, S. W., Vasarla, N. S., Jong, M. C., Wai, L. C., Vempati, S., and et al. 2008 “Design, Assembly and Reliability of Large Die (21x21mm2) and Fine-pitch (150μm) Cu/low-k Flip Chip Package.” Paper presented at 10th Electronic Packaging Technology Conference, Singapore, December 9 – 12.
Ong, Y. Y., Lim, Y. L., Yan, L. L., Vempati, S., Liao, E. B., Vaidyanathan, K., Yoon, S. U., and et al. 2007. “Self-Assembly of components Using Shape-Matching.” Paper presented at 9th Electronic Packaging Technology Conference, Singapore, December 10 – 12.
Neo, K. E., Ong, Y.Y., Huynh, H.V., Hor, T.S.A. 2007. “A single-molecular pathway from heterometallic MM′ (M = BaII, MnII; M′ = CrIII) oxalato complexes to intermetallic composite oxides.” Journal of Materials Chemistry 10 (17): 1002 – 1006.
Lim, Y.L., Ong, Y.Y., Yan, L.L., Kripesh, Vempati. S. R., and Liao, E. B., 2007. Method for micro component self-assembly. US Patent 20090116207, filed November 5.
Ong, Y.Y.; Lim, Y.L.; Yan, L.L.; Liao, E.B.; Kripesh, V. 2006. “Dry Self-Assembly & Gangbonding of Microcomponents from Silicon Carrier to Substrate Wafer.” Paper presented at 31st International Electronics Manufacturing Technology Symposium, Malaysia, November 8 – 10.
Ong, Y. Y.; Yan, L.L.; Kripesh, V. 2006. Removal of Self-Assembled Monolayer on Gold Substrates. Poster presented at Asia-Pacific Conference of Transducers and Micro-Nano Technology, Singapore, June 25 – 28.