Teaching Assistant Dr ONG Yue Ying

B.Sc. (Hons), PhD, National University of Singapore


Contact Information


Department of Chemistry, NUS 
3 Science Drive 3 
Singapore 117543 
Office: S5-04-08
Tel: 6516-2665
Email: chmoyy@nus.edu.sg


Representative Publications

  • Yue Ying Ong, Soon Wee Ho, Vasarla Nagendra Sekhar, et al., ‘Underfill Selection, Characterization and Reliability Study for Fine-Pitch, Large Die Cu/low-K Flip Chip Package’, IEEE Transactions on Components, Packaging and Manufacturing Technology, 1 (2011) 279 - 290
  • Tai Chong Chai, Xiaowu Zhang, J H Lau, C S Selvanayagam, P Damaruganath, Y Y G Hoe, Yue Ying Ong, et al., 'Development of Large Die Fine-Pitch Cu/Low-k FCBGA Package With Through Silicon via (TSV) Interposer', IEEE Transactions on Components, Packaging and Manufacturing Technology, 1 (2011) 660-672
  • Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, et al., ‘Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package’, Microelectronics Reliability 50 (2010) 986-994
  • X. Ong, S. W. Ho, Y. Y. Ong, et al.,'Underfill selection methodology for fine pitch Cu/low-k FCBGA packages', Microelectronics Reliability, 49 (2009) 150-162
  • X. Zhang, A. Kumar, Q. X. Zhang, Y. Y. Ong, et al.,' Application of Piezoresistive Stress Sensors in Ultra Thin Device Handling and Characterization', Sensors and Actuators A: Physical, 156 (2009) 2-7
  • Kian Eang Neo, Yue Ying Ong, Han Vinh Huynh, T.S. Andy Hor, J. Mater. Chem., 2007, 17, 1002
  • Patent: Y. L. Lim, Y. Y. Ong, L. L. Yan, V. Kripesh, S. R. 'Method for micro component self-assembly', US 20090116207, 2007